Market Strategies for Lab Automation Vendors: A Comprehensive Study

https://www.marketsandmarkets.com/Market-Reports/lab-automation-market-1158.html

The global lab automation market is projected to reach USD 7.1 billion by 2028 from USD 5.1 billion in 2022, growing at a CAGR of 5.8% during the forecast period. Rising technological advancements primarily drive the growth of this market in lab automation, rise in demand for miniaturize process equipment further supports the market growth. However, higher initial investment impedes the market growth. However, the slow adoption of lab automation by some laboratories and the long waiting period for workflow implementation are expected to restrain the market growth.

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What is PCB Embedded Component Process?
The resistance and capacitance buried in multi layers PCB process is a process of burying resistors and capacitors inside the PCB board. Usually, the resistors and capacitors on the PCB are directly soldered on the board through mounting technology, while the buried resistor and capacitor process is to embed the resistors and capacitors into the internal layer of the PCB board.

This kind of printed circuit board consists of a first dielectric layer, a buried resistor, a circuit layer and a second dielectric layer in order from bottom to top. Among them, the part of the buried resistor without a circuit layer on the buried resistor is covered with a polymer isolation layer, and the surface of the polymer isolation layer is roughened, the surface roughness Rz is bigger than 0.01 μm, and the thickness of the polymer isolation layer at the corners is at least 0.1 μm.

The printed circuit board of the utility model covers a layer of polymer isolation layer on the surface of the buried resistor, thereby protecting the buried resistor from being attacked and corroded by chemical chemicals during subsequent wet processes such as browning and super-coarseness, and improving the efficiency of manufacturing buried resistors. Resistor plate process capabilities further promote the application of buried resistive plates to inner layer buried resistors.

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